The Glaze3DÔ chip

• 304 pin BGA

• 1.5M logic gates

• 130 mm2 die size

• External SDR SDRAM interface

  • depth and/or color buffer stored here in higher resolutions
  • max 128 MB
  • 64- or 128-bit interface

• PCI and 2X/4X AGP interfaces: AGP interface supports direct AGP texturing

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